PEEK With Low Thermal Conductivity

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Description

Form: Granule; Feature: Heat Insulation and Low Thermal Conductivity; Application: Extrusion & Injection Moulding; Customized: Yes and contact for material solution.

  • Polymers
  • peek with low thermal conductivity
  • peek conductivity
  • heat insulation peek

Domain icon Manufacturer/ Producer

31800 Zhejiang - China

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